Multitech MTR-C2 Manual do Utilizador descarregar pdf (Página 12)

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TECHNOLOGY | 802.15.4 / SUB-GIG

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TECHNOLOGY | ANTENNAS

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TECHNOLOGY | BLUETOOTH

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TECHNOLOGY | CELLULAR

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SIERRA WIRELESS AIRPRIME® EMBEDDED

MODULES HL SERIES

Compact, Flexible, and Future Proof 2G, 3G, and 4G

Essential Modules

Figure1: HL Series

• GSM/GPRS/EDGE/HSUPA/HSDPA/

LTE

• GNSS (GPS + GLONASS)

• Dual SIM Dual Standby technology

for maximum network connectivity

• Smallest 2G to 4G form factor on the

market

• Device management made easy

with ready-to-use ﬁrmware upgrades

using AirVantage Management

Service

• Use one design for your 2G, 3G, and

4G deployments

• Choose between LGA solder-down

or snap-in integration, for supply-

chain and lifecycle management

requirements

KEY FEATURES

KEY BENEFITS

FLEXIBLE: SOLDER DOWN OR

CHOOSE THE SNAP!IN SOCKET

TO SWITCH MODULES ANY TIME

The compact form factor offers

the choice of soldering down the

module for efﬁcient high-volume

production or, using a snap-in socket

on the same solder pads for total

ﬂexibility in prototyping or smaller

volume runs. The innovative snap-in

socket allows device manufacturers

to deploy or change modules at any

point in the production and product

life cycles.

FUTURE PROOF: INTELLIGENT

PIN-TO-PIN COMPATIBILITY

TO SUPPORT EVOLVING

TECHNOLOGIES

The core and extension pins on

the common form factor enables

forward and backward compatibility

between the different 2G, 3G, and

4G module variants. This means that

the mechanical pin location delivers

the same function across the series.

The optional custom pins allow for

new features as technology evolves

making it the most future proof

module on the market.

Figure 2: Snap-in option or

solder-down design

Sierra Wireless AirPrime®

HL embedded modules offer

everything device manufacturers

need to meet essential

connectivity requirements for

machine-to-machine (M2M)

applications such as healthcare,

point of sale terminals, ﬂeet

management, tracking, and

consumer electronics.

Key differentiators include a

common form factor, small

size, low-power consumption,

enhanced RF performance,

optional GNSS (GPS and

GLONASS), and worldwide

coverage.

COMPACT: THE SMALLEST 2G

TO 4G FORM FACTOR ON THE

MARKET

The HL Series is the smallest module

on the market sharing a common

form factor across 2G, 3G, and 4G

technologies. Now, with just one

PCB design, device manufacturers

can easily integrate voice and

data connectivity and deploy in

any region, on any wireless mobile

network.

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